6DVERSE Trademark Information

On Monday, December 13, 2021, a U.S. federal trademark registration was filed for 6DVERSE. The USPTO has given the 6DVERSE trademark serial number of 97169834. The current federal status of this trademark filing is PUBLISHED FOR OPPOSITION. The correspondent listed for 6DVERSE is PAULO A. DE ALMEIDA of ********,********, ***** **** . The 6DVERSE trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products , Computer & Software Services & Scientific Services . The description provided to the USPTO for 6DVERSE is Electronic computer hardware and downloadable and recorded software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus, namely, camera modules being cameras to be incorporated into electronic devices; Downloadable and recorded computer software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits for use in image signal processing; Design libraries, namely, downloadable electronic data files featuring integrated circuit and semiconductor designs for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Semiconductor chipsets; Semiconductor chip sets; Microchips being components of computer hardware; Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; Integrated circuits (IC); Micro integrated circuits; Electronic circuits; Computer hardware; Electronic components for computers; Computer circuit boards; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Electric and electronic circuits; Wafers for integrated circuits; Integrated circuit cards and components; Semiconductors; Semiconductor devices; Semiconductor wafers; Semiconductor chips, chip sets, and modules for 3D sensing in the nature of collecting information in three dimensions, 3D sensor fusion, and 3D perception in the nature of making certain decisions and reactions in accordance with the collected information; Plates, glass slides or chips having multi-well arrays that can be used in chemical analysis, biological analysis or patterning for scientific, laboratory or medical research use; Semiconductor chip sets for use in enabling memory, multiway communications and processing capabilities; Known good die computer memory; Dynamic random access memory (DRAM module); Specialty dynamic random access memory (DRAM); Automotive dynamic random access memory (DRAM); Industrial dynamic random access memory (DRAM); Computer memory; Computer memory devices; Integrated circuits for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Circuits for heavy current; Cards with integrated circuits; Microcircuits; Very large scale integration (VLSI) semiconductor integrated circuits; Flexible circuit boards; Dynamic random access memory (DRAM).