ACCRETE Trademark Information

Trademark by Kabushiki Kaisha Tokyo Seimitsu

Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wa...

Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/fl...

Brokerage of manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning ma...

Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demo...

Rental of manufacturing apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge...

Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring senso...

Classification Information

Intent to Use Trademark - Applicant has not submitted proof of use in commerce the the USPTO.

Primary Class: Class Details:
Class (007)
Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
Class (009)
Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
Class (036)
Insurance; financial affairs; monetary affairs; real estate affairs.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
Class (037)
Building construction; repair; installation services.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
Class (040)
Treatment of materials.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
Class (042)
Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
General Information
Word mark: ACCRETE
Status/Status Date:
ABANDONED - NO STATEMENT OF USE FILED
9/5/2004
Serial Number: 76182003
Filing Date: 12/15/2000
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanic
Mark Description: NOT AVAILABLE
Type Of Mark: Service Mark
Published For Opposition Date: 12/10/2002
Last Applicant/Owner:
Kabushiki Kaisha Tokyo Seimitsu
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Mark Drawing Code: Typeset (Words/letter/Number)
Design Search:
(NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
********
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***** ****
Current Status:
ABANDONED - NO STATEMENT OF USE FILED
9/5/2004
Correspondent Search:
CURTIS B HAMRE is a correspondent of ACCRETE trademark.
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