C3SP Trademark Information

APTOS CERPORATION

Electronic components, namely, solder bumped semiconductor silicon chips and wafers; solder bumped electronic substrates for use in the manufacture of integrated circuit devices and solder bumped circuit boards

Words that describe this mark

electronic   components       solder   bumped   semiconductor   silicon   chips   wafers   solder   bumped   electronic   substrates   use   manufacture   integrated   circuit   devices   solder   bumped   circuit   boards  

This is a brand page for the C3SP trademark by APTOS CERPORATION  in Milpitas, , 95035.

Write a review about a product or service associated with this C3SP trademark. Or, contact the owner APTOS CERPORATION of the C3SP trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the C3SP trademark.

On Tuesday, June 22, 1999, a U.S. federal trademark registration was filed for C3SP. The USPTO has given the C3SP trademark serial number of 75733908. The current federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE. The correspondent listed for C3SP is RANDY W. TUNG of TUNG & ASSOCIATES, 838 WEST LONG LAKE RD. SUITE 120, BLOOMFIELD HILLS, MI 48302 . The C3SP trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products . The description provided to the USPTO for C3SP is Electronic components, namely, solder bumped semiconductor silicon chips and wafers; solder bumped electronic substrates for use in the manufacture of integrated circuit devices and solder bumped circuit boards.

Word mark: C3SP
Status/Status Date:
ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
2/4/2004
Serial Number: 75733908
Filing Date: 6/22/1999
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Electronic components, namely, solder bumped semiconductor silicon chips and wafers; solder bumped electronic substrates for use in the manufacture of integrated circuit devices and solder bumped circuit boards
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: 7/9/2002
Last Applicant/Owner: APTOS CERPORATION
Milpitas 95035
Mark Drawing Code: Typeset (Words/letter/Number)
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
TUNG & ASSOCIATES
838 WEST LONG LAKE RD. SUITE 120
BLOOMFIELD HILLS, MI 48302

Intent to Use Trademark - Applicant has not submitted proof of use in commerce the the USPTO.

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Current Trademark Status:
2/4/2004
ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Correspondent Search:

RANDY W. TUNG is a correspondent of C3SP trademark.

Current Overall Rating:
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