HI-BOND Trademark Information

BOC GROUP, INC., THE

Brazing Flux

Perfect for these industries

Words that describe this mark

brazing   flux  

This is a brand page for the HI-BOND trademark by BOC GROUP, INC., THE  in Montvale, , .

Write a review about a product or service associated with this HI-BOND trademark. Or, contact the owner BOC GROUP, INC., THE of the HI-BOND trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the HI-BOND trademark.

On Wednesday, July 7, 1943, a U.S. federal trademark registration was filed for HI-BOND. The USPTO has given the HI-BOND trademark serial number of 71461901. The current federal status of this trademark filing is CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE. The correspondent listed for HI-BOND is ? of *****, *****, ***** ***** . The HI-BOND trademark is filed in the category of Metal Products . The description provided to the USPTO for HI-BOND is Brazing Flux.

Word mark: HI-BOND
Status/Status Date:
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
1/15/2005
Serial Number: 71461901
Filing Date: 7/7/1943
Registration Number: 0406543
Registration Date: 4/11/1944
Goods and Services: Brazing Flux
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: N/A
Last Applicant/Owner: BOC GROUP, INC., THE
Montvale
Mark Drawing Code: Typeset (Words/letter/Number)
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
*****
*****
*****
*****

Classification Information

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

Primary Class: Class Details:
Class (006)
Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores.
First Use Anywhere: : 4/17/1943
First Use In Commerce: 4/17/1943

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Current Trademark Status:
1/15/2005
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
Correspondent Search:

? is a correspondent of HI-BOND trademark.

Current Overall Rating:
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