LEAP Trademark Information

Uniqarta, Inc.

Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; electronic assembly manufacturing machines; semiconductor wafer processing machines; semiconductor assembly and semiconductor...

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Words that describe this mark

semiconductor   manufacturing   machines       semiconductor   assembly   equipment   nature   automated   die   attach   equipment     automated   die   sorting   equipment     automated   die   bonding   equipment   flip   chip   bonding  

This is a brand page for the LEAP trademark by Uniqarta, Inc.  in Cambridge, MA, 02138.

Write a review about a product or service associated with this LEAP trademark. Or, contact the owner Uniqarta, Inc. of the LEAP trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the LEAP trademark.

On Monday, May 6, 2019, a U.S. federal trademark registration was filed for LEAP. The USPTO has given the LEAP trademark serial number of 88417729. The current federal status of this trademark filing is NEW APPLICATION FILED. The correspondent listed for LEAP is PERRY J. VISCOUNTY of LATHAM & WATKINS LLP, 650 TOWN CENTER DRIVE, SUITE 2000, COSTA MESA, CA 92626 . The LEAP trademark is filed in the category of Machinery Products . The description provided to the USPTO for LEAP is Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; electronic assembly manufacturing machines; semiconductor wafer processing machines; semiconductor assembly and semiconductor packaging equipment adhesive tape; adhesive tape for industrial use.

Word mark: LEAP
Status/Status Date:
NEW APPLICATION FILED
5/9/2019
Serial Number: 88417729
Filing Date: 5/6/2019
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; electronic assembly manufacturing machines; semiconductor wafer processing machines; semiconductor assembly and semiconductor packaging equipment adhesive tape; adhesive tape for industrial use
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: N/A
Last Applicant/Owner: Uniqarta, Inc.
Cambridge, MA 02138
Mark Drawing Code: Standard Character Mark
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
LATHAM & WATKINS LLP
650 TOWN CENTER DRIVE, SUITE 2000
COSTA MESA, CA 92626

Trademark Events

Event Date: Event Description
2019-05-21 NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
2019-05-09 NEW APPLICATION ENTERED IN TRAM

Classification Information

Intent to Use Trademark - Applicant has not submitted proof of use in commerce the the USPTO.

Primary Class: Class Details:
Class (007)
Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
First Use Anywhere: : Not provided
First Use In Commerce: Not provided

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Current Trademark Status:
5/9/2019
NEW APPLICATION FILED
Correspondent Search:

PERRY J. VISCOUNTY is a correspondent of LEAP trademark.

Current Overall Rating:
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