Logo Mark Trademark Information

Trademark by Kabushiki Kaisha Tokyo Seimitsu

Metal working machines and tools, namely grinding machines, metal cutting machines; semiconductor manufacturing equipment, namely sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, and dicing machine, wafer inspection systems, chemical mechanical grinders and back grinders

Precision measuring machines, namely wafer thickness measuring machine, digital length measuring machine, surface texture measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, machine control gauge, electric micrometer, pneumatic micrometer; wafer inspection units

Classification Information

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

Primary Class: Class Details:
Class (007)
Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
First Use Anywhere:: 4/6/2001
First Use In Commerce: 4/16/2001
Class (009)
Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
First Use Anywhere:: 4/15/2001
First Use In Commerce: 4/20/2001
General Information
Word mark: (NO WORD)
Status/Status Date:
REGISTERED AND RENEWED
6/8/2016
Serial Number: 75983578
Filing Date: 11/12/1999
Registration Number: 3073864
Registration Date: 3/28/2006
Goods and Services: Metal working machines and tools, namely grinding machines, metal cutting machines; semiconductor manufacturing equipment, namely sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, and dicing machine, wafer inspection systems, chemical mechanical grinders and back grinders
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: 3/22/2005
Last Applicant/Owner:
Kabushiki Kaisha Tokyo Seimitsu
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Mark Drawing Code: Drawing/Design (No Words)
Design Search:
Concentric ovals and ovals within ovals (Geometric figures and solids - Ovals) see more design...
Plain single line triangles (Geometric figures and solids - Triangles) see more design...
Two Triangles (Geometric figures and solids - Triangles) see more design...
Squares as carriers or squares as single or multiple line borders (Geometric figures and solids - Squares) see more design...
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
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***** ****
Current Status:
REGISTERED AND RENEWED
6/8/2016
Correspondent Search:
Danielle I. Mattessich is a correspondent of the Logo trademark.
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