NEOVERSE Trademark Information

On Monday, December 13, 2021, a U.S. federal trademark registration was filed for NEOVERSE. The USPTO has given the NEOVERSE trademark serial number of 97169878. The current federal status of this trademark filing is ABANDONED - EXPRESS. The correspondent listed for NEOVERSE is PAULO A. DE ALMEIDA of ********,********, ***** **** . The NEOVERSE trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products , Computer & Software Services & Scientific Services . The description provided to the USPTO for NEOVERSE is Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality), AR (Augmented Reality) and MR(Mixed Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus; Software and electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Chipsets; Semiconductor chip sets; Microchips (computer hardware); Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits (IC); micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer hardware; computer components; computer circuits; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Electric and electronic circuits; Wafers for integrated circuits; Integrated circuit cards and components; Semiconductors; Semiconductor devices; Semiconductor wafers; Chips, chip sets, and modules for 3D sensing, 3D sensor fusion and 3D perception. For clarity purpose, 3D sensing means to collect information in 3D dimension, and 3D perception means to make certain decision and reaction in accordance with such collected information; Plates, glass slides or chips having multi-well arrays that can be used in chemical analysis, biological analysis or patterning for scientific, laboratory or medical research use; Semiconductor chip sets for use in enabling memory, multiway communications and processing capabilities; KGDM; known good die; known good die memory; DRAM module; specialty DRAM; automotive DRAM; industrial DRAM; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer memory; computer memory devices; Integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Circuits for heavy current; Cards with integrated circuits; Microcircuits; Very large scale integration (VLSI) semiconductor integrated circuits; Electric and electronic circuits; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Wafers for integrated circuits; Integrated circuit cards and components; Flexible circuit boards; Dynamic random access memory (DRAM).