SUPERFAST 3G Trademark Information

Ultratech, Inc.

Machines for optical inspection of semiconductor wafer and other substrates

This is a brand page for the SUPERFAST 3G trademark by Ultratech, Inc.  in San Jose, CA, 95134.

Write a review about a product or service associated with this SUPERFAST 3G trademark. Or, contact the owner Ultratech, Inc. of the SUPERFAST 3G trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the SUPERFAST 3G trademark.

On Friday, May 27, 2016, a U.S. federal trademark registration was filed for SUPERFAST 3G. The USPTO has given the SUPERFAST 3G trademark serial number of 87052231. The current federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE. The correspondent listed for SUPERFAST 3G is Robert Hayden of Royse Law Firm, PC, 149 Commonwealth Dr., Suite 1001, Menlo Park CA 94025 . The SUPERFAST 3G trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products . The description provided to the USPTO for SUPERFAST 3G is Machines for manufacturing semiconductor wafers and other substrates that include wafer and substrate inspection capability that use various inspection technologies including coherent gradient sensing technology to enable various applications as within-die, die-to-die and wafer-to-wafer characterizations with the machines and computer software for use in operating said machines; and replacement parts and consumable materials for the aforesaid goods.

Word mark: SUPERFAST 3G
Status/Status Date:
ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
11/20/2017
Serial Number: 87052231
Filing Date: 5/27/2016
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Machines for manufacturing semiconductor wafers and other substrates that include wafer and substrate inspection capability that use various inspection technologies including coherent gradient sensing technology to enable various applications as within-die, die-to-die and wafer-to-wafer characterizations with the machines and computer software for use in operating said machines; and replacement parts and consumable materials for the aforesaid goods
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: N/A
Last Applicant/Owner: Ultratech, Inc.
San Jose, CA 95134
Mark Drawing Code: Standard Character Mark
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: ("3G")
Correspondent:
Royse Law Firm, PC
149 Commonwealth Dr., Suite 1001
Menlo Park CA 94025

Classification Information

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

Primary Class: Class Details:
Class (009)
Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
First Use Anywhere: : 12/1/2012
First Use In Commerce: 12/1/2012

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Current Trademark Status:
11/20/2017
ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Correspondent Search:

Robert Hayden is a correspondent of SUPERFAST 3G trademark.

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