TEC-PACK Trademark Information

Trademark by Ventec Electronics (Suzhou) Co., Ltd.

Electrical insulating materials; sheet panels and blank panel sheets made out of thermoset for use in the manufacture of circuit boards; sheet panels and blank panel sheets made out of semi-processed plastic for use in the manufacture of circuit boards; sheet panels, blank panel sheets, tubes, rods, blocks and strips all made out of polymers, plastic and resin for use in the manufacture of circuit boards

Design services for electrical insulation systems using films, sheets tubes, rods, blocks and strips all made out of polymers and plastic for use in the manufacture of circuit boards

Classification Information

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

Primary Class: Class Details:
Class (017)
Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
Class (042)
Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
First Use Anywhere:: Not provided
First Use In Commerce: Not provided
General Information
Word mark: TEC-PACK
Status/Status Date:
USPTO PLACED APPLICATION ON HOLD PENDING OTHER ACTION
4/14/2022
Serial Number: 90440015
Filing Date: 12/31/2020
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Electrical insulating materials; sheet panels and blank panel sheets made out of thermoset for use in the manufacture of circuit boards; sheet panels and blank panel sheets made out of semi-processed plastic for use in the manufacture of circuit boards; sheet panels, blank panel sheets, tubes, rods, blocks and strips all made out of polymers, plastic and resin for use in the manufacture of circuit boards
Mark Description: NOT AVAILABLE
Type Of Mark: Service Mark
Published For Opposition Date: N/A
Last Applicant/Owner:
Ventec Electronics (Suzhou) Co., Ltd.
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Mark Drawing Code: Standard Character Mark
Design Search:
(NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
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Current Status:
USPTO PLACED APPLICATION ON HOLD PENDING OTHER ACTION
4/14/2022
Correspondent Search:
Boris Umansky, Esq. is a correspondent of TEC-PACK trademark.
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